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Harmattan AI développe des systèmes autonomes et des logiciels de gestion de missions pour la défense. Ses clients comprennent des forces armées et des industriels, qui les utilisent pour l’ISR, l’interception de drones et la guerre électronique.

Repères sur Harmattan AI
Modèle
B2B
Type d’entreprise
Financée par du capital-risque
Stade
Licorne
Siège
Paris
Domaine officiel
harmattan.ai
Création
2024 · 2 ans
Effectif public
226 employés
Dernière levée
Series B · 2026-01-12
Montant annoncé
200 000 000 $
Offres ouvertes
113

Investisseurs mentionnés

Détails de l’offre

La description complète publiée par Harmattan AI.

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About us

Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces. Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges. We operate in a demanding environment where rigor, ownership, and execution are expected.

About the role

As a Mechanical Engineer within our Electronic Warfare team, you will design the mechanical structures and packaging that house and protect our EW/SIGINT electronics in demanding field conditions – from concept to field deployment. You will translate RF and electronic constraints into robust mechanical designs, working hand-in-hand with hardware, software, GNC and ML teams.

Responsibilities

RF Electronic Packaging: Design mechanical packaging for RF and high-power electronics (a core requirement of the role).

  • Thermal Management: Design thermal solutions for high-power, high-density electronics.
  • Shielding & Cabling: Integrate EMI/RF shielding and manage cable routing and constraints.
  • Mechanical
  • Design: Own mechanical design from concept through prototyping and validation.
  • Technical Coordination: Collaborate across HW, software, GNC and ML teams on integration and technical interfaces.
  • System Reviews & Documentation: Contribute to design and architecture reviews and maintain documentation and traceability.

Candidate requirements

Experience in RF electronic packaging is a must.

  • Previous RF experience (radar, radio or EW) is a strong plus, to keep the associated constraints in mind (shielding, thermal, cabling, etc.).
  • Strong background in mechanical design, thermal management and packaging.
  • Broad engineering culture with understanding of electrical and embedded systems.
  • MSc in Mechanical Engineering; PhD is a plus.
  • Rigorous, structured and mission-driven mindset with strong analytical skills.
  • Excellent communication and documentation abilities. We look forward to hearing how you can help shape the future of autonomous defense systems at Harmattan AI.

Prérequis

  • Expérience en packaging électronique RF
  • Conception mécanique
  • Gestion thermique
  • Blindage EMI/RF
  • Routage de câbles
  • MSc en génie mécanique