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Harmattan AI develops autonomous systems and mission-management software for defence. Armed forces and industrial clients use them for ISR, drone interception and electronic warfare.

Information about Harmattan AI
Model
B2B
Company type
Venture-backed
Stage
Unicorn
Headquarters
Paris
Official domain
harmattan.ai
Founded
2024 · 2 years
Published headcount
226 employees
Published valuation
1,4 Md$Source ↗
Latest funding round
Series B · 2026-01-12
Amount announced
200 000 000 $
Open jobs
108

Investors mentioned

Job details

The full description published by Harmattan AI.

View original job listing ↗

About us

Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces. Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges. We operate in a demanding environment where rigor, ownership, and execution are expected.

About the role

As a Mechanical Engineer within our Electronic Warfare team, you will design the mechanical structures and packaging that house and protect our EW/SIGINT electronics in demanding field conditions – from concept to field deployment. You will translate RF and electronic constraints into robust mechanical designs, working hand-in-hand with hardware, software, GNC and ML teams.

Responsibilities

RF Electronic Packaging: Design mechanical packaging for RF and high-power electronics (a core requirement of the role).

  • Thermal Management: Design thermal solutions for high-power, high-density electronics.
  • Shielding & Cabling: Integrate EMI/RF shielding and manage cable routing and constraints.
  • Mechanical
  • Design: Own mechanical design from concept through prototyping and validation.
  • Technical Coordination: Collaborate across HW, software, GNC and ML teams on integration and technical interfaces.
  • System Reviews & Documentation: Contribute to design and architecture reviews and maintain documentation and traceability.

Candidate requirements

Experience in RF electronic packaging is a must.

  • Previous RF experience (radar, radio or EW) is a strong plus, to keep the associated constraints in mind (shielding, thermal, cabling, etc.).
  • Strong background in mechanical design, thermal management and packaging.
  • Broad engineering culture with understanding of electrical and embedded systems.
  • MSc in Mechanical Engineering; PhD is a plus.
  • Rigorous, structured and mission-driven mindset with strong analytical skills.
  • Excellent communication and documentation abilities. We look forward to hearing how you can help shape the future of autonomous defense systems at Harmattan AI.

Requirements

  • Expérience en packaging électronique RF
  • Conception mécanique
  • Gestion thermique
  • Blindage EMI/RF
  • Routage de câbles
  • MSc en génie mécanique

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